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The aim of this paper is to describe how the authors made a film about recovery.

A number of service users were auditioned for the Recovery Film and four chosen to participate. The film was directed and edited by the second author who has lived experience of mental health problems.

Five main themes are covered in the film: the experience of being mentally ill; causes of peoples' mental illness; personal definitions of recovery; what helps people; and the process of recovery for each of the four participants.

The Recovery Film was short‐listed for a Mind Media Award, has been shown at a number of national conferences and is available on the internet.

To present the aims and preliminary findings of a research project to investigate the manufacture of multilayer glass substrates built up from thin glass sheets.

The approaches that may be taken to create glass substrates and the challenges involved are described. Excimer laser machining was used for the formation of microvias and other features in individual glass sheets. In addition, methods for the electroless copper metallisation of the smooth glass surfaces were studied. Finally, a technique for the lamination of the glass layers using low temperature, pressure assisted bonding was investigated.

Microvias with 100 μm diameter entry holes were successfully machined in 100 μm thick glass sheets and process windows were identified to reduce debris and hole taper. Using appropriate pre‐treatment steps, electroless copper coatings could be deposited uniformly over the smooth glass surface, however, further improvements in adhesion were found to be necessary. The direct lamination of glass layers was found to be possible using pressure and temperature applied over long periods of time. Improvements to the lamination process were made to reduce the initiation of cracks which were assessed using fatigue testing.

The feasibility of the individual steps in the fabrication of glass substrates has been demonstrated. Further work is necessary to control the processes in order to limit microcrack formation, improve copper coating adhesion and ensure uniform lamination of multiple glass layers.

The use of glass materials could enable the manufacture of substrates for high density electrical interconnect with integrated optical waveguides.

Microfluidic or “lab‐on‐a‐chip” technology is seen as a key enabler in the rapidly expanding market for medical point‐of‐care and other kinds of portable diagnostic device. The purpose of this paper is to discuss two proposed packaging processes for large‐scale manufacture of microfluidic systems.

In the first packaging process, polymer overmoulding of a microfluidic chip is used to form a fluidic manifold integrated with the device in a single step. The anticipated advantages of the proposed method of packaging are ease of assembly and low part count. The second process involves the use of low‐frequency induction heating (LFIH) for the sealing of polymer microfluidics. The method requires no chamber, and provides fast and selective heating to the interface to be joined.

Initial work with glass microfluidics demonstrates feasibility for overmoulding through two separate sealing principles. One uses the overmould as a physical support structure and providing sealing using a compliant ferrule. The other relies on adhesion between the material of the overmould and the microfluidic device to provide a seal. As regards LFIH work on selection and structuring of susceptor materials is reported, together with analysis of the dimensions of the heat‐affected zone. Acrylic plates are joined using a thin (<10 μm) nickel susceptor providing a fluid seal that withstands a pressure of 590 kPa.

Microfluidic chips have until now been produced in relatively small numbers. To scale‐up from laboratory systems to the production volumes required for mass markets, packaging methods need to be adapted to mass manufacture.

The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with embedded wireless components.

Business processes of the electronic manufacturing supply chain were analysed. A business case and the system opportunities for life cycle monitoring, based on embedded wireless components system were developed. Radio frequency identification (RFID) assembly technology was adapted for the integration of components into a multi‐layer printed circuit board (PCB).

By storing product‐related information into electronic products, tracing of components, monitoring of processes, operations and costs, environmentally optimised recycling can be enhanced.

The research undertaken so far relates to the embedding of RFID tags into PCBs. Wireless components with more processing power will be used in the next project phase.

The paper details how wireless components can be embedded into multi‐layer PCBs and how a business case for a life cycle monitoring system can be established.

To introduce the Innovative Electronics Manufacturing Research Centre Flagship Project: Integrated Optical and Electronic Interconnect PCB Manufacturing, its objectives, its consortium of three universities and ten companies and to describe the university research being carried out. This paper briefly reviews the motivation for developing novel polymer formulations, fabrication techniques, layout design rules and characterisation techniques for hybrid electronic and optical printed circuit boards (PCBs) using multimode polymer optical waveguide interconnects.

The authors are investigating a number of different fabrication techniques which they compare with each other and with modelled calculations of waveguide components. The fabrication techniques include photolithography, laser ablation, direct laser writing, embossing, extrusion and ink jet printing.

A number of design rules for polymer multimode waveguides have been found and published. Techniques for ink jetting polymer to print waveguides and laser ablation techniques have been developed. New formulations of polymer which cure faster for direct writing have also been developed.

Further work is needed to thicken the ink jet printed polymer and to investigate side wall roughness of the ablated waveguides and development of new polymer formulations for dry film. Further research is also needed on construction of prototype system demonstrators.

The fabrication techniques being developed are designed to be transferred to industrial PCB manufacturers to enable them to make higher value optical PCBs. The design rules being discovered are being entered into commercial PCB layout software to aid designers of optical PCBs.

The paper is of interest to PCB manufacturers who wish to upgrade their processes to be able to manufacture optical PCBs. The university research is original and some has been published as shown in the publications in the reference list.

The encapsulation of electronic assemblies within thermoplastic polymers is an attractive technology for the protection of circuitry used in harsh environments, such as those experienced in automotive applications. However, the relatively low‐thermal conductivity of the encapsulating polymer will introduce a thermally insulating barrier, which will impact on the dissipation of heat from the components and may result in the build‐up of stresses in the structure. This paper therefore seeks to present the results from computational models used to investigate the thermal and thermo‐mechanical issues arising during the operation of such electronic modules. In particular, a two‐shot overmoulded structure comprising an inner layer of water soluble and an outer layer of conventional engineering thermoplastics was investigated, due to this type of structure's potential to enable the easy separation of the electronics from the polymer at the end‐of‐life for recycling.

Representative finite element models of the overmoulded electronic structures were constructed and the effects of the polymer overmould were analysed through thermal and thermo‐mechanical simulations. Investigations were also carried out to explore the effect of materials properties on the overmoulded structure.

Models have shown that some power de‐rating of components is required to prevent temperatures exceeding those in unencapsulated circuits and have quantified the benefits of adding thermally conductive fillers to the polymer. Simulations have also clearly demonstrated the benefits of foamed polymers in reducing thermal stresses in the assemblies, despite their poorer thermal conductivity compared with solid polymers.

The paper illustrates the thermal issues affecting the overmoulded electronics and gives some guidelines for improving their performance.

To study the influence of storage time and environment on the solderability of electroless nickel plated samples with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solders and to provide criteria for the use of an electroless nickel (Ni‐P) under bump metallization (UBM) without immersion gold protection.

Electroless nickel coatings were deposited onto pure aluminium foil through a procedure developed for the UBM of wafers prior to flip chip bumping. Their solderability with lead‐free solders was studied using the wetting balance technique. Samples stored in different environments for different periods of time were tested to study the dependence of the solderability of Ni‐P coatings on the storage time and temperature. The degree of oxidation of the Ni‐P coatings was examined by means of X‐ray photoelectron spectroscopy and the surface microstructure and roughness of the coatings were analyzed by scanning electron microscopy and atomic force microscopy.

It was found that the Ni‐P coatings were unacceptable for direct soldering without the assistance of a flux, due to poor wettability, even when using a freshly prepared Ni‐P coating. Therefore, a suitable flux with nitrogen inerting had to be applied to assist the soldering process. The results also show that the solderability of Ni‐P coatings was affected by the phosphorus content, and the Ni‐P coating with high phosphorus content had a good solderability. The storage time and temperature did not influence the wettability significantly with the assistance of strong flux.

The stability of the plating solution and the consistence of the phosphorus content in the coating are not easily controlled. This has resulted in implications for surface analysis and wetting testing. Ni‐P coatings with different levels of phosphorus content are being investigated in detail.

The value of the paper lies in its study on the solderability of lead‐free solders to Ni‐P coating after storage in different environments and for different periods, which can provide some criteria for the use of Ni‐P UBM without immersion gold protection.

The purpose of this paper is to present the need, and a potential solution, for in‐plane routing of optical signals for optical‐enabled circuit boards.

Multimode waveguides and integrated 45° in‐plane mirror structures were made in a low loss acrylate‐based photopolymer using excimer laser ablation. The fabrication of multimode waveguides and mirrors was carried out in a single laser system which minimised alignment issues.

It was established that in‐plane mirror fabrication using laser ablation can be achieved and can potentially be used to define mirrors in waveguides made by other methods such as photolithography.

While the concept (integrated in‐plane mirror) was demonstrated, the viability of its deployment will depend on the results of optical loss measurements for which further research is required.

The paper gives an overview of the design concept and fabrication steps for an in‐plane embedded mirror.

The purpose of this paper is to provide a profile of Zoe Riley.

Using a case study approach, Zoe provides an account of her background and is then interviewed by Jerome.

Zoe’s account reveals a remarkable resilience developed through adversity but nurtured by the love of her grandparents.

Mental illness surrounded Zoe when she was growing up. Her own mother experienced years of distress. Her grandfather effectively was her father. Despite the childhood adversity and her own teenage problems, she came through it all. These are the stories you read about in textbooks.

Zoe reminds us that people in distress want to find connection. They do not want us sitting there writing notes and not even looking at them!

The authors talk about “wounded healers”. Dr Glenn Roberts said that his own bouts of depression made it easier for him to sit with people in similar turmoil. The value of peer support has been underrated by many.

It is of course a truism to say that everyone’s journey of recovery is unique. The author knows Zoe has already touched the lives of many people. The author is sure she has so much more to contribute.

We study the spatial diffusion of stock backdating, an instance of corporate misconduct about which public information was virtually absent until 2005. Contrary to the findings of Bizjack, Lemmon, and Whitby (2009), our results reveal that this “invisible” practice did not diffuse through board interlocks. Rather, stock backdating spread through geographic proximity: firms were more likely to backdate stock options to the extent that other firms located geographically close to them had done so. Lending support to the importance of localized interactions among members of the local business elite, the effect of geographical proximity was conditional on high levels of local board interlocks. Our findings regarding the differential impact of geographic proximity and board interlocks on the diffusion of this invisible practice are analogous to the diffusion pattern of controversial practices proposed by Davis and Greve (1997).